Ved gund cornell5/26/2023 Hidden within the shell are microscopic cavities filled with rubidium and sodium biflouride – chemicals that can thermally react and decompose the microchip. Others disintegrate when they reach a specific temperature, requiring a heating element and power source to be attached.Ĭornell engineers have created a transient architecture that evades these drawbacks by using a silicon-dioxide microchip attached to a polycarbonate shell. Some transient electronics use soluble conductors that dissolve when contacted by water, requiring the presence of moisture. There are a number of existing techniques for triggering the vaporization, each with inherent drawbacks. And because no harmful byproducts are released upon vaporization, engineers envision biomedical and environmental applications along with data protection. This unique ability to self-destruct is at the heart of an emerging technology known as transient electronics, in which key portions of a circuit, or the whole circuit itself, can discreetly disintegrate or dissolve. The chemicals are capable of vaporizing thinned silicon-dioxide microchips packaged in the shell.Įngineers from Cornell and Honeywell Aerospace have demonstrated a new method for remotely vaporizing electronics into thin air, giving devices the ability to vanish – along with their valuable data – if they were to get into the wrong hands. A polycarbonate shell 125 microns thick after a vaporization test of its embedded rubidium and sodium biflouride.
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